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For Immediate Release...

Zhubei City, HsinChu County, Taiwan July 19, 2010 – Sonix™, Inc., announced today that it is expanding and has opened a office and demonstration facility in HsinChu City, Taiwan.

Sonix™ has invested in new demonstration lab in Taiwan to support the local customer base with sales, service and applications. Sonix™ now has offices in HsinCHu City and Kaohsiung and are fully staffed with trained service and applications engineers. The HsinChu center has the latest Sonix™ equipment available for local customers to view, test and use for applications support. The onsite technical team focuses on solving complex problems and providing new solutions and support for wafer and packaging applications. The Sonix™ team works with many different types of applications including stacked die/3D, molded flip chip, bonded wafer, 3D wafer, LED’s, capacitors and much more.

Please contact any of our Sonix Taiwan staff to arrange for an appointment to see the latest Sonix solutions. The contact information is listed below.

Sonix™, Inc, a wholly owned subsidiary of the Danaher Corporation (NYSE:DHR), is a leading manufacturer of scanning acoustic microscopes and non-destructive testing equipment.

Since opening our doors in 1986, Sonix™ has been a consistent innovator in non-destructive testing. Sonix™ was the first company to bring PC-based, digital imaging solutions to our customers. Since then, Sonix™ has continued to push the technology envelope and provide our customers with superior inspection technologies and engineering advancements.

Contact Information

Sonix™ Taiwan (HsinChu County Location)
302 HsinChu County,
#8, Zi-Qiang South Road,
11F-7, Zhubei City, Taiwan ROC
Ph: 886-3-657-9181
TAIWAN Regional Sales Manager: BH Lee - bh.lee@sonix.com • mobile: 886-975-693-597
Field Service Engineer: Peter Wang - peter.wang@sonix.com • mobile: 886-956-030-935

Sonix™ Taiwan (Kaohsiung Location)
1/F-1 No. 236 Jainnan Road
Nanzi District
Kaohsiung City, 811, Taiwan ROC
Field Service Engineer: Jader Wang - jader.wang@sonix.com • mobile: 886-928-687-825

For Immediate Release...

MILPITAS, CA August 1, 2008 – Sonix™, Inc., announced today that it is expanding its Application and Sales Support on the West Coast by establishing a strategic partnership with Silicon Turnkey Solutions Inc. (STS), a leader in innovation and ultra-high performance technologies in the realm of IC testing and qualification. Sonix™ Inc. will be promoting acoustic applications expertise jointly with STS to support customers.

STS has enhanced its Device Analysis capabilities by adding a full range of Sonix™ acoustic microscopy equipment including the best of class VISION and robust FUSION solutions. Sonix™ and STS have application engineer’s onsite to perform acoustic analysis including advanced packages, complex IC’s, multi-chip modules, system-on-a-wafer, laminated PCB’s and more. Application engineers are fully trained on latest technologies and best acoustic practices.

Shwetha Jakkidi will head our applications and customer education processes at the Silicon Valley facility. Shwetha has been a valued acoustic microscopy engineer with Sonix™ for over five years providing expertise in solving complex problems and developing new technologies.

Sonix™, Inc, a wholly owned subsidiary of the Danaher Corporation (NYSE:DHR), is a leading manufacturer of scanning acoustic microscopes and non-destructive testing equipment.

Since opening our doors in 1986, Sonix™ has been a consistent innovator in non-destructive testing. Sonix™ was the first company to bring PC-based, digital imaging solutions to our customers. Since then, Sonix™ has continued to push the technology envelope and provide our customers with superior inspection technologies and engineering advancements.

Our systems are used for the non-destructive inspection of a variety of materials including semiconductor packages, automotive parts and other advanced components. Based on proprietary software, hardware and patented innovations, our systems have evolved over many years of experience working with you, the customer. We strive to build relationships with our customers and these relationships have helped us build superior products. Our customers come from a variety of industries including semiconductor packaging, component manufacturing, automotive, aerospace, and traditional non-destructive testing industries.

ABOUT SILICON TURNKEY SOLUTIONS

Incorporated in 2001, Silicon Turnkey Solutions Inc. has established itself as a leading-edge provider of Specialty Assembly, Reliability, Qualification and Electrical Test services, serving a broad spectrum of customer bases. As a trusted strategic partner and with a proven track record, STS continues to be on the technological forefront by utilizing the most sophisticated test and reliability equipment and high level in-house project management and engineering expertise. STS is recognized as a leader in providing innovative and cost competitive turnkey solutions for complex 3D and highly integrated microelectronic devices such as SIPs, MEMs, SOC, Flip Chip and ASICs.

Contact Information

Business Development
801 Buckeye Court
Milpitas, CA 95035, USA
Ph: 408-432-1790 X 289
Fax: 408-432-7350
Email: sales@sts-usa.com

New Location...

Sonix™ is proud to announce that we have opened a direct China sales office and have added a Chinese Sales Manager, located in Shanghai, China at:

Room 502, Building 6, Lane 280, Linhong Road Changning District, Shanghai 200335

Telephone: 021-61289870

Our new Sales Manager, Scott Lui is a degreed engineer and brings many years of failure analysis and reliability expertise to Sonix™. Scott is very familiar with SAM technology and works close with customers to solve problems and offer solutions. Scott will work closely with Sonix™ existing distribution channel, Teltec and will also work directly with Sonix™ existing and potential customer base.

Sonix™ will install its latest state of the art SAM solutions in the China facility. This equipment will be intended to educate customers as well has help solve problems and support current activity.

Sonix™, Inc, is a wholly owned subsidiary of the Danaher Corporations (NYSE:DHR), is a leading manufacturer of scanning acoustic microscopes and non-destructive testing equipment.

Since opening our doors in 1986, we have been a consistent innovator in non-destructive testing. We were the first company to bring PC-based, digital imaging solutions to our customers. Since then, we have continued to push the technology envelope and provide our customers with superior inspection technologies and engineering advancements.

Our systems are used for the non-destructive inspection of a variety of materials including semiconductor packages, automotive parts and other advanced components. Based on proprietary software, hardware and patented innovations, our systems have evolved over many years of experience working with you, the customer. We strive to build relationships with our customers and these relationships have helped us build better products. Our customers come from a variety of industries including semiconductor packaging, component manufacturing, automotive, aerospace, and traditional non-destructive testing industries.

Our breakthrough technologies and engineering innovations have given us the knowledge, the technology and the ingenuity to provide customers with advanced acoustic solutions.

Announcement...

One Limited Use Demo UHR-2001One Limited Use Demo UHR-2001

Designed to accommodate single components and JEDEC trays, responds to the challenge of high- resolution imaging applications and generates sharp, clear images. For exceptional spatial resolution, the UHR-2001 uses a 0.5 micron encoder on the scan axis and an improved ball screw for greater positioning accuracy.

• State-of-the-art linear servo motor provides smooth and repeatable motion at high speeds
• The transducer is directly coupled to the servo forcer and eliminates vibration often present in belt drives. The unique focusing system eliminates bulky mechanisms from the scan axis shuttle.

Price $85,000 USD (Normal List Price = $183,775)

This price is for a complete system including: (1) 15 MHZ, .500”, (1) 75 MHz, .500” and (1) 10 MHZ thru-transmission transducers and TAMI

One Limited Use Demo Sonix™ FUSION

Active Scan Area: 315 x 315 x 50mm, Full 1meter per second scan speed, Standard High Speed 1GHz full wave form Analog to Digital converter up sampling to 4 GHz, Minimum resolution 1 micron per data point

• Easy Transducer Changeover: New transducer mount eliminates search tube, and manual height adjustments, and threading transducer onto search tube. Just slide the transducer into the transducer fixture and move the locking knob into place. The transducer height will be the same every time and it only takes seconds to change.
• High Contrast Tank Bottom: Bright colored tank bottom improves visibility inside tank and helps to easily see parts under test.
• Transducer based Z-axis: Focusing is achieved by a motorized z-axis that raises and lowers the transducer. This allows for easy focusing of part and raising transducer out of water when system is not in use.

Price $115,000 USD (Normal List Price =$159,775)

This price is for a complete system including: (1) 15 MHZ, .500”, (1) 75 MHz, .500” and (1) 10 MHZ thru-transmission transducers and TAMI

One Limited Use Demo Sonix™ VISION

Active Scan Area: 350 x 350 x 50mm, Full 1meter per second scan speed @ 20um pixel size, Standard High Speed 1GHz full wave form Analog to Digital converter up sampling to 4 GHz, Minimum resolution 1 micron per data point

• Easy Transducer Changeover: New transducer mount eliminates search tube, and manual height adjustments, and threading transducer onto search tube. Just slide the transducer into the transducer fixture and move the locking knob into place. The transducer height will be the same every time and it only takes seconds to change.
• High Contrast Tank Bottom: Bright colored tank bottom improves visibility inside tank and helps to easily see parts under test.
• Hands Free Load Port: Open load port with light-curtain for safety allows loading/unloading of parts without having to open/close a safety cover.
• Transducer based Z-axis: Focusing is achieved by a motorized z-axis that raises and lowers the transducer. This allows for easy focusing of part and raising transducer out of water when system is not in use.

Price $165,000 USD (Normal List Price = $239,275)

This price is for a complete system including: (1) 15 MHZ, .500”, (1) 75 MHz, .500” and (1) 10 MHZ thru-transmission transducers and TAMI

All Systems above come with a Sonix™ standard 12 month warranty

For more information on this great offer please contact Sonix™ Headquarters:

8700 Morrissette Drive
Springfield, VA 22152
Tel: 703.440.0222
Fax: 703.440.9512
info@sonix.com

New Location...

Sonix™, Inc., a leading manufacturer of scanning acoustic microscopes and non-destructive testing equipment has opened a new testing applications lab and offices in Irvine, California. This office will support customers globally with specific emphasis on customers located in the Western United States and Asia.

The Sonix™ West Coast lab and offices is staffed with a full-time Sr. Applications Engineer, Mr. Alex Kwan as well as sales and service support. The lab will be stocked with Sonix™ latest equipment and technologies in order to support customers with product selection and ongoing application support.

Sonix™ is committed to providing industry leading support, service and applications needs to our customers and future customers.

Sonix™ looks forward to supporting your application needs.

Sonix™, Inc.
17982 Sky Park Circle
Irvine, CA 92614
Tel: 949.748.3838
Fax: 949.748.3839
sales@sonix.com

New Products...

1. Sonix™ Fusion™ - A New Generation in Acoustic Microscopy
2. Sonix™ Vision™ - Advanced Acoustic Microscopy for stacked die Bonded Wafers and MEMS.

Combines the best features of the long-standing benchmark HS1000, UHR-2001, and Q350 products into a single Scanning Acoustic Microscope platform updated with the latest production grade components.

» Download Brochure (PDF)

Advanced Acoustic Microscopy for stacked die Bonded Wafers and Mems.
- Failure Analysis
- Reliability testing
- Packaging
- Process control