Flip Chip Inspection

As devices become smaller and smarter, packaged semiconductor manufacturers are competing on their ability to deliver innovative form factors and materials. Sonix continuously advances our acoustic microscopy and analysis tools to clearly identify defects in the newest, most complex flip chip designs.

Sonix systems provide the image quality and throughput manufacturers need to eliminate defects at the process level and maximize inspection rates on the production line. Sonix provides automated tray scanning of individual and board-mounted devices, with tools to optimize analysis of features such as:

• Underfill material quality and voiding
• Thermal interface material (TIM) layer
• Solder joint voiding
• Solder joint delamination
• Solder joint cracking
• Die cracking
• Filler particle density and distribution