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Packaged Semiconductor Inspection Applications
Image quality. Speed. Uptime. They’re all crucial. Getting all three at the same time is the challenge. It takes continuous innovation, advancing the state of the art to keep pace with the semiconductor industry’s own exponential progress.
Sonix has been the innovation leader since 1986. Today, the ECHO line of scanning acoustic microscopes sets the standard for image quality, speed and uptime to help you keep pace with new packaging materials and difficult form factors. The ECHO platform will remain at the forefront as we continue to add features and enhance performance for years to come.
Choose our ECHO scanning acoustic microscope for the inspection of stacked die packages, complex flip chips and more traditional plastic packages. ECHO VS adds industry-leading features for the clearest imaging of molded flip chip (MUF), CSP, MCM, stacked die, hybrids, and other advanced packaging applications. The ECHO Pro provides fully automated handling for 100% inspection in high-volume production environments.
Sonix is ISO 9001/2008 Certified. All of our tools are Semi S2/S8 certified.
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