Ball Grid Arrays

Ball Grid Arrays (BGAs) are the dominant method of connecting chips packaged in a variety of ways to the main board. Because this method is so widely used, acoustic inspection of BGA packages is among the most common applications. The Sonix ECHO platform is ideal for identifying BGA defects.

Sonix has extensive experience helping customers identify moisture-induced cracking, delaminations, lid seal integrity, die attach and other defects in both plastic and metal BGA packages. That’s why so many manufacturers worldwide choose Sonix systems to identify and characterize:

• Non-bonded interfaces
• Die tilt or cupping
• Porous or insufficient die attach
• Die cracks
• Delaminations
• Excessive filler height or die attach material
• Molding compound voids
• Package cracks
• Solder mask or “lead finger” disbonding
• Delamination within the substrate