Hybrid and Multi-Chip Module (MCM) Inspection

Sonix systems have the ability to detect very thin air gaps and easily penetrate dense metallic materials. Typical applications include qualifying of solder material and deposition to prevent overheating failures and inspection of lid seals to ensure they won’t become compromised over time. Now, as stacked die and flip chip techniques become common, advanced scanning techniques have become even more important to identify features such as:

• Heat sink solder bond integrity
• Substrate bond integrity
• Die bond integrity
• Lid seal bond quality
• Die cracks
• Insufficient solder material
• Excessive solder reflow
• Seal integrity