Stacked Die Imaging (SDI)
For many years, microelectronic packages consisted of only a few layers. Now as 3D packaging becomes a common method for bringing more functionality to smaller devices, inspection systems have to penetrate many more layers, including overmolds, metallization and dielectric layers below a die, multiple stacked silicon dies, or all of these.
Acoustic reflections from deeper layers within the package are weaker than reflections from shallower layers. This is the result of basic physics, as the energy of the signal is reduced by reflections from each successive layer. SDI technology exclusively from Sonix, allows customers to set a gain profile that provides clear imaging at each layer without requiring multiple scans and without obscuring defects in shallow images through oversaturation.
- Detects air defects as small as 0.01 micron in thickness
- Transducers from 10MHz through 300 MHz, designed to address all types of applications and materials
- SDI option is ideal for clearly imaging multiple layers in 3D packages without the need to perform multiple scans
|This advanced scanning acoustic microscope features the Sonix Image Enhancement Suite for industry-leading image quality.||Sonix ECHO provides a universal inspection tool for 3D package development, production and failure analysis.|
|Our next-generation solution for high-volume production environments adds fully automated JEDEC tray handling to maximize productivity.|
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