Plastic-Encapsulated IC Inspection

The first microelectronic application for scanning acoustic microscopes was inspecting for moisture-induced “popcorn” cracks in plastic-encapsulated semiconductor devices. Today, the newest generation of Sonix acoustic microscopes is ideal for imaging traditional crack defects as well as a much broader range of defects.

Sonix systems provide the precise defect detection require for reliable failure analysis, as well as the throughput needed for manufacturers who want to implement 100% inspection of production ICs. Automated inspection of ICs can identify and characterize:

• Non-bonded interfaces
• Die tilt or cupping
• Porous or insufficient die attach
• Die cracks
• Delaminations
• Molding compound voids
• Package cracks (“popcorn” cracks)
• Lead frame delamination