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Wafer Inspection Solutions
Sonix provides manual and automated wafer inspection and metrology systems for wafers ranging from 100mm to 300mm, with extensive analysis capabilities at both the wafer and device level. These industry-leading systems are used by the world’s top manufacturers to ensure quality from development through production.
Sonix offers a complete line of hardware and software solutions optimized for finding defects and improving process control in bonded wafers including MEMS, CMOS, BSI sensors, memory, TSV, LED and other demanding applications. With fully automated handling, 200mm and 300mm SECS/GEM compliance, and the options and expertise to meet your specific application requirements. Sonix is the only partner you need for front-end quality, productivity and yield.
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