Wafer Inspection Applications
Historically, acoustic scanning microscopes were found primarily in back-end development and manufacturing of packaged semiconductors. Today, front-end manufacturers are also adopting sophisticated wafer inspection and metrology techniques to aid in product development, refine manufacturing processes, improve yield and ensure the long-term reliability of their products. Relentless market demands for smaller, smarter products require an inspection process that eliminates defects and improves yields from the very beginning of the fabrication process. Sonix developed the industry’s first automated wafer inspection tool, AutoWafer, with scanning and analysis features specifically optimized for MEMS, TSV, LED, BSI and other bonded wafer applications.
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