Backside Illuminated (BSI) Sensor Inspection
Backside illuminated (BSI) sensors represent a major advancement in CMOS photosensor technology, allowing compact cameras, phones and security systems to capture much more detailed images even in low-light conditions. As costs come down, BSIs will be found in more applications and manufacturers will be looking to technologies such as stacked-die integration to combine optics, memory and logic in the smallest possible space. These advanced technologies require sophisticated bonding techniques and the ability to clearly inspect bonds in any position, at any depth in the bonded wafer. Sonix systems provide the image quality and analysis tools needed for advanced BSI sensor inspection, along with wafer-handling robotics designed to keep pace with high-throughput production.
|AutoWafer Pro provides fast, high-resolution scanning of 200mm and 300mm bonded wafers, supporting 100 percent inspection for improved yields and a faster time to market.||AutoWafer provides a complete, production-ready solution for scanning wafers from 100mm to 200mm, including multiple sizes in a single batch.|
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