Bonded Wafer Inspection
With increasing miniaturization and complexity, silicon devices depend on the quality of the wafer bonding process for long-term reliability. Electromechanical testing can’t detect wafer bowing, warping, micro-cracking, bonding gaps or contamination that can eventually lead to device failure. Sonix wafer inspection systems can detect gaps and voids of less than 0.1 micron, providing superior diagnostic imaging for wafer bonding and device-level bond rings in silicon-on-insulator, anodic, metal-to-metal and other high-end bonded wafer applications. Defects can be precisely mapped so that good areas of the wafer can be salvaged to reduce scrap and to improve wafer reliability and yield.
|AutoWafer Pro provides fast, high-resolution scanning of 200mm and 300mm bonded wafers, supporting 100 percent inspection for improved yields and a faster time to market.||AutoWafer provides a complete, production-ready solution for scanning wafers from 100mm to 200mm, including multiple sizes in a single batch.|
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