When manufacturing high-performance LEDs, it’s important to identify and remove defective dies from the manufacturing process before they reach the packaging stage. Efficient, accurate analysis at both the bonded wafer level and the die level is critical to maximizing product reliability and profitability, as well as improving manufacturing processes to improve yields. Sonix automated wafer inspection systems provide superior image quality, without the need to re-scan for wafer analysis and device-level LED analysis. And our exclusive wafer handling and drying processes support the highest throughput with minimal operator intervention.
|AutoWafer Pro provides fast, high-resolution scanning of 200mm and 300mm bonded wafers, supporting 100 percent inspection for improved yields and a faster time to market.||AutoWafer provides a complete, production-ready solution for scanning wafers from 100mm to 200mm, including multiple sizes in a single batch.|
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