Microelectromechanical Systems (MEMS) Inspection
Microelectromechanical systems (MEMS) allow equipment such as gyroscopes and accelerometers to be incorporated in silicon devices. Because these structures are so small and delicate, they depend on the integrity of the hermetic bond to avoid contamination and ensure reliable operation. MEMS applications depend on clear imaging of bond rings. In an automotive airbag application, for example, 100% inspection is required to comply with safety regulations. In a motion-sensitive smartphone application, 100% inspection helps to avoid warranty costs and ensure customer satisfaction. Sonix wafer inspection systems provide the image quality and throughput needed for 100% inspection in the most challenging MEMS applications.
|AutoWafer Pro provides fast, high-resolution scanning of 200mm and 300mm bonded wafers, supporting 100 percent inspection for improved yields and a faster time to market.||AutoWafer provides a complete, production-ready solution for scanning wafers from 100mm to 200mm, including multiple sizes in a single batch.|
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