Through-Silicon Vias (TSV) Inspection
The need for increased functionality and speed in a smaller footprint has led manufacturers to stacked die solutions, with TSVs providing electrical connections between device layers. To ensure reliable operation, it’s crucial to verify that TSV holes and trenches have the proper depth, width and uniformity, and that the conductors within them are free of voids and cracks. Because TSVs are structured in the z-dimension, scanning and analysis can be particularly challenging. Sonix systems provide advanced wafer metrology features to image the TSV interfaces of interest, efficiently gathering data in all directions in a single scan.
|AutoWafer Pro provides fast, high-resolution scanning of 200mm and 300mm bonded wafers, supporting 100 percent inspection for improved yields and a faster time to market.||AutoWafer provides a complete, production-ready solution for scanning wafers from 100mm to 200mm, including multiple sizes in a single batch.|
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