Today, front-end manufacturers are adopting nondestructive testing (NDT) as a wafer solution. Manufacturers are performing semiconductor wafer inspection and wafer metrology to help streamline product development, refine manufacturing processes, improve yield and ensure the long-term reliability of their products.
Image quality. Speed. Uptime. They’re all crucial. Getting all three at the same time in a nondestructive testing (NDT) solution for package inspection is the challenge. It takes continuous innovation, advancing the state of the art to keep pace with the semiconductor industry’s own exponential progress.
Ultrasonic NDT imaging offers a powerful tool for identifying defects and increasing yield and quality in applications that depend on reliable, void-free bonding of materials.
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