Package Inspection Applications

Sonix has been the innovation leader since 1986. Today, the ECHO line of scanning acoustic microscopes sets the standard for PCB inspection speed and image quality, to help you keep pace with new packaging materials and difficult form factors. The ECHO platform will remain at the forefront as we continue to add features and enhance performance for years to come.

Package Inspection Applications

Choose our ECHO scanning acoustic microscope for package inspection of stacked dies, complex flip chips and more traditional plastic packages. ECHO VS adds industry-leading features for the clearest imaging of Cu pillars, molded flip chip (MUF), CSP, MCM, stacked die, hybrids, and other advanced package inspection applications.

Molded Underfill (MUF) Inspection

Molded underfill (MUF) is increasingly being used to lower costs and increase throughput in flip chip assembly. Compared to older underfill processes, MUF decreases material costs, allows for batch processing of both flip chip underfill and overmolding in strip format, and enables smaller package size for today’s powerful mobile devices

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Stacked Die Imaging (SDI)

For many years, microelectronic packages consisted of only a few layers. Now, as 3D packaging becomes a common method for bringing more functionality to smaller devices, die inspection systems have to penetrate many more layers – including overmolds, metallization and dielectric layers below a die, multiple stacked dies, or all of these.

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Flip Chip Inspection

As devices become smaller and smarter, packaged semiconductor manufacturers are competing on their ability to deliver innovative form factors and materials. Sonix continuously advances our acoustic microscopy and analysis tools to clearly identify defects in the newest, most complex flip chip packages.

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Wafer Chip Scale Package (CSP) Inspection

Chip scale packages (CSPs) allow for integration of greater functionality in a much smaller package. Today’s consumer devices require smaller and more powerful CSPs, with thinner materials and more complex layouts.

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Ball Grid Array

Ball Grid Arrays

Features Ball Grid Arrays (BGAs) are the dominant method of connecting chips packaged in a variety of ways to the main board. Because BGA package technology is so widely used, BGA inspection is among the most common applications for acoustic microscopy. The Sonix ECHO platform is the ideal BGA inspection platform. Ball Grid Arrays: Package […]

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Plastic-Encapsulated IC Inspection

The first microelectronic application for scanning acoustic microscopes was inspecting for moisture-induced “popcorn” cracks in plastic-encapsulated IC packages.

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Hybrid and Multi-Chip Module (MCM) Package Inspection

Sonix systems have the ability to detect very thin air gaps and easily penetrate dense metallic materials used in multi-chip module (MCM) and hybrid integrated circuit designs.

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