Sonix systems have the ability to detect very thin air gaps and easily penetrate dense metallic materials used in multi-chip module (MCM) and hybrid integrated circuit designs. Typical multi-chip inspection applications include qualifying of solder material and deposition to prevent overheating failures and inspection of lid seals to ensure they won’t become compromised over time. Now, as stacked die and flip chip techniques become common, advanced ultrasonic multi-chip inspection techniques have become even more important to identify MCM and hybrid chip module features.
Failure Types Commonly Detected:
| Hybrids, Multi-Chip Modules and Power Devices | 127 KB | Due to SAMs superior ability of detect very thin air gaps and ability to easy penetrate dense metallic materials, acoustic inspection of hybrids is a dominant failure analysis technique. | DOWNLOAD |
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