Wafer Inspection Applications

Relentless market demands for smaller, smarter products require a wafer solution that helps eliminate defects and improve yields from the very beginning of the fabrication process.

Wafer Inspection Applications

To meet a new market need, Sonix developed AutoWafer, the industry’s first wafer solution that enables fully automated inspection. With automated wafer processing and wafer analysis features, AutoWafer is optimized for production-speed inspection of MEMS, TSV, LED, BSI and other bonded wafer technologies.

MEMS Inspection

Microelectromechanical systems (MEMS) allow equipment such as pressure sensors, microphones, gyroscopes and accelerometers to be incorporated in silicon devices.

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LED Inspection

When manufacturing high-performance LEDs, it’s important to identify and remove defective LED dies from the manufacturing process before they reach the packaging stage.

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Backside Illuminated (BSI) Sensor Inspection

The backside illuminated sensor (BSI sensor) represents a major advancement in CMOS image sensor technology. BSI sensors allow compact cameras, phones and security systems to capture much more detailed images, even in low-light conditions, by eliminating the unnecessary reflectivity that occurs when the active matrix and its interconnects are located in front of the photocathode layer.

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Through-Silicon Vias – TSV Inspection

The need for increased functionality and speed in a smaller footprint has led manufacturers to stacked die solutions, with TSV (through-silicon via) technology providing electrical connections between device layers.

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Bonded Wafer Image

Bonded Wafer Inspection

With increasing miniaturization and complexity, silicon devices depend on the quality of the wafer bonding process for long-term reliability.

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