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AutoWafer™
Installed in more wafer applications than all other ultrasonic wafer scanning tools combined, AutoWafer provides a complete, production-ready solution for scanning wafers from 100mm to 200mm, including multiple sizes in a single batch.
Product Details:
AutoWafer is an excellent scanning tool for development and production environments, providing high-resolution identification of bond defects in wafer applications such as MEMS, CMOS, memory, TSV and LED. Robotic cassette handling and sorting of approved and failed wafers helps speed production, while our advanced transducers and auto-analysis tools make it quick and easy to identify even the smallest, most subtle defects.
- Ideal for detecting wafer-to-wafer bonding defects
- A fully automated, production-ready scanning solution for MEMS, CMOS, BSI sensors, memory, TSV, LED and other applications employing wafers 200mm and smaller
- Provides wafer map with die-level pass/fail indicators (optional)
- Provides analysis (optional)
- 200mm SECS/GEM
- TSV entrenched metrology
Product Literature
| File Name | Language | Date updated | File Size |
|---|---|---|---|
| Sonix Overview Brochure | en-US | 10-2012 | 3.65 MB |
