Features

Sonix S-series ultrasonic NDT transducers are designed in-house to meet the demanding nondestructive testing requirements of semiconductor manufacturing. We offer the collaborative expertise to help customers choose the best ultrasonic NDT transducer for their application, based on three primary considerations:

• Resolution: Spatial resolution determines the smallest features and defects customers can see in x-y dimensions. Depth resolution determines the thinnest layers that can be resolved. Both spatial and depth resolution improve with increasing frequency. However, there’s a tradeoff between frequency and penetration. The goal is to choose a frequency sufficient to penetrate to and detect the defects customers are looking for.
• Focal zone determines the depth of focus in the z dimension, or how many layers you can see clearly in a scan. Here, the tradeoff is that a deeper focal zone means lower spatial resolution. The goal is to pick the highest frequency that will penetrate to the interface of interest, such as TSVs, while providing optimal resolution.
• Focal length determines the depth of penetration within the silicon where resolution and focus are at their maximum.

Sonix Transducers

• Designed in-house. Sonix designs its own transducers, optimizing spatial and depth resolution for the best possible imaging on actual samples of the devices our customers manufacture. A generic transducer simply can’t match Sonix image quality.
• Wide frequency range. We offer more than 40 transducers from 15MHz to 300MHz, covering the full range of frequencies required in microelectronic manufacturing.
• Robust construction. Sonix transducers are designed to withstand the demands of nonstop operation in high-throughput production environments.
• S-series transducers. Sonix’s advanced transducers incorporate proprietary technology to improve signal sensitivity and spatial resolution, reduce delay line reflections and provide more robust performance.